| 摘要 |
PROBLEM TO BE SOLVED: To provide a power board heat dissipating structure in which the heat dissipation of a power device can be performed properly and which is small in size and low cost. SOLUTION: In the power substrate heat sink structure, the power substrate 1 mounts a power wiring surface 1a having its power element 11, a connector 12 and a power wiring pattern 13, etc. on the heat sink 3 for heat dissipation in which a high thermal conductive gel is filled in a recess 31, while attaching grease for thermal resistance reduction and an insulation sheet 2 by holding. Since the recess 31 of the upper surface of the heat sink 3 for the heat dissipation is provided in response to the position, size and the shape, etc. so as to contain the power element 11 on the power substrate 1, the power element 11, provided on the power wiring surface 1a of the power substrate 1, is engaged with the recess 31 provided on the heat sink 3 for the heat dissipation, and dipped in the high thermal conductive gel filled in the recess 31. COPYRIGHT: (C)2005,JPO&NCIPI |
