| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting composition for an optical semiconductor, a sealant for an optical semiconductor device, a die bond material for an optical semiconductor device, and an underfill material for an optical semiconductor device, all of them are excellent in transparency, heat resistance, light resistance, and adhesiveness to a housing material, hardly generate cracks and exfoliation even when subjected to a rapid thermal change, such as a soldering reflow process or heat cycle, and do not cause problems, such as yellowing, under use conditions; and a semiconductor device using the above-described materials. <P>SOLUTION: The thermosetting composition for an optical semiconductor contains a silicone copolymer resin (A) having, in its molecule, at least one alicyclic epoxy-containing group, structural units represented by general formula (1), and structural units represented by general formula (2), a bifunctional silicone resin (B) having one or more glycidyl-containing groups in the molecule, and a thermosetting agent reactive with the above-described alicyclic epoxy-containing group and glycidyl-containing group. <P>COPYRIGHT: (C)2008,JPO&INPIT |
