| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board material capable of size reduction by forming smaller width and diameter of concave portion, such as a slit considering the metal layer thickness. SOLUTION: After obtaining a metal-insulator compound material by forming metal layers 3 and 4 on both the primary planes of an insulator 2, etching resist 6 is formed on all the faces or a part of a metal layer 3 for forming a circuit. Then, at least a part of the metal layer 3 is subjected to etching processing, in succession, and then to milling processing. By removing the etching resist 6, thereafter, a circuit board material is manufactured, having a concave portion 10 such as slits and holes that satisfy the relation: c/d≤2.5 of a width or diameter c with respect to a metal layer thickness d. COPYRIGHT: (C)2008,JPO&INPIT
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