发明名称 SUBSTRATE TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating apparatus, a set of which can treat various types of substrates by flexibly treating a substrate in accordance with it, and which can reduce a manufacturing cost of a device. SOLUTION: A controller reads identification information of a container 1 containing not-yet-treated substrates W, makes each treating section treat the substrates W in response to a recipe in accordance with the identification information, and then makes the treating section use only either of a low pressure dryer LPD and a direct air dryer DAD. Therefore, the substrate W is flexibly treated in accordance with a type of it, a set of the substrate treating apparatus can treat various types of substrates W, and the manufacturing cost of the device can be reduced. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205359(A) 申请公布日期 2008.09.04
申请号 JP20070042105 申请日期 2007.02.22
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NANBA TOSHIMITSU
分类号 H01L21/304;H01L21/677 主分类号 H01L21/304
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