发明名称 WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate that prevents variations in resistance value while preventing the resistance value of a resistor from being affected by variations in electrode thickness. <P>SOLUTION: The wiring substrate 10 is provided with an insulating layer 3, a first electrode 2 and a second electrode 2 separated from each other on the insulating layer 3, a resistor film-thickness adjusting groove 7 arranged on a surface part of the insulating layer 3 between the first electrode 2 and the second electrode 2, and a resistor 1 that is embedded inside the resistor film-thickness adjusting groove 7 while its one end is electrically connected to the first electrode 2, the other end is electrically connected to the second electrode 2, and its film thickness is thickly adjusted by the depth of the resistor film-thickness adjusting groove 7. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008218803(A) 申请公布日期 2008.09.18
申请号 JP20070055698 申请日期 2007.03.06
申请人 TOPPAN PRINTING CO LTD 发明人 SEKINE HIDEKATSU;SHIMA SHINYA
分类号 H05K1/16;H01C17/06;H01L23/12;H05K3/12 主分类号 H05K1/16
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