| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module facilitating wiring work by forming structure enabling wiring without inserting a lead extended from a laser module into a heat sink. SOLUTION: The thermoelectric module 10 capable of controlling temperature in a semiconductor laser module 30 comprises: an upper substrate 11 on which an electrode pattern 11b for thermoelements is formed; a lower substrate 12 on which an electrode pattern 12a for thermoelements is formed; and a plurality of thermoelements 13 arranged and fixed so that they are connected in series between the electrode patterns for thermoelements on both the substrates. On the lower substrate 12 on which the electrode pattern 12a for thermoelements is formed, a wiring pattern 12c for lead connection is formed, where the wiring pattern 12c to which a plurality of leads extended from a stem package 31 are connected. An opening 11a is formed on the upper substrate 11, and a lead inserted into the opening 11a is joined to a wiring pattern 12a for connecting the lead. COPYRIGHT: (C)2008,JPO&INPIT |
