| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive dry film for solder resist capable of forming an interlayer insulation film, a planarizing film, a surface protective film, and an insulating film for a high-density mounting board excellent in resolution, adhesion and electric insulation, a cured product thereof, and a circuit board and electronic components with the cured product. <P>SOLUTION: The positive dry film for solder resist is formed of a composition comprising an alkali-soluble resin, a compound having a quinonediazide group and a crosslinking agent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
