| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat curing die bond film exhibiting excellent adhesion to an adherend in which a substrate and a semiconductor chip are protected against smearing with soaking adhesive, and to provide a dicing die bond film using it. <P>SOLUTION: The heat curing die bond film for use in production of a semiconductor device principally comprises 5-15 wt.% of a thermoplastic resin component and 45-55 wt.% of a thermosetting resin component wherein the melt viscosity at 100°C before heat curing is in the range of 400-2,500 Pa s. <P>COPYRIGHT: (C)2009,JPO&INPIT |
