| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor also having high curing property while excellent in flowability. SOLUTION: The resin composition for sealing a semiconductor contains a compound (A) containing two or more of glycidyl ether groups and a curing agent. In the resin composition for sealing a semiconductor, when measurement by a dielectric analyzer is performed under the condition that a measurement temperature is 175°C and measurement frequency is 100 Hz, the maximum slope exists within 60 seconds from starting of the measurement and the value is 2.0 to 6.0, and further, the lowest ion viscosity exists within 40 seconds from starting of the measurement and the value is 4.0 to 7.0. COPYRIGHT: (C)2009,JPO&INPIT |
