| 摘要 |
PROBLEM TO BE SOLVED: To provide sheet sticking apparatus and sticking method which do not require troublesome work for pressure reduction controlling and can impart a strong pressing force. SOLUTION: This sheet sticking apparatus 10 for sticking a heat sensitive adhesive sheet S on a semiconductor wafer W provided with a bump W1 comprises a sticking means 11 for sticking the adhesive sheet S on the semiconductor wafer W by deforming a sticking force imparting sheet 37 by adjusting the pressures in the first and second decompression chambers C1 and C2 formed in a case 34, and a press roller 48 for imparting a pressing force on the adhesive sheet S stuck on the semiconductor wafer W. COPYRIGHT: (C)2009,JPO&INPIT |
