METHOD FOR MANUFACTURING CHIP WITH BONDING AGENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip with bonding agent not requiring chip push-up but pickup in which a holding force of the chip not picked up in progress of pickup does not vary. SOLUTION: The method for manufacturing the chip with bonding agent is characterized in that the die-bond bonding agent layer 24 and wafer 1 obtained by previous cutting process are laminated on a closed contact layer 31 of a fixing jig 3 and the chip 13 is picked up from the fixing jig with the die-bond bonding agent layer by deforming the closed contact layer of the fixing jig. The fixing jig is laminated at its closed contact layer on the surface having a projected region 36 of the jig base board 30 and bonded at the upper surface of a side wall 35. On the surface including the projected region of the jig base board, a divided space 37 is formed. The jig base board is provided with at least one through-hole 38 provided through the external side and the divided space. The closed contact layer can be deformed by absorbing the air within the divided space via the through-hole of the fixing jig. COPYRIGHT: (C)2009,JPO&INPIT