| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having a stack via structure providing interlayer connection of high reliability. SOLUTION: An interlayer connection structure consists of a substrate 10 equipped with: a wiring layer 20; an interlayer insulation layer 30 which is formed on the wiring layer 20 and is provided with a via hole VH1 reaching the wiring layer 20; and a via pad 40 formed, from within the via hole VH1, on the interlayer insulation layer 30 near the hole. A stack via structure 5 is formed by stacking a plurality of interlayer connection structures, with a plurality of via pads 40, 42, and 44 stacked vertically to be connected to each other. A recess C which is recessed from a peripheral part is provided at the central part of the upper surface of each of via pads 40, 42, and 44. On the bottom surface of the recess C of a lower side via pad, the bottom part of the via pad of upper side is arranged. COPYRIGHT: (C)2009,JPO&INPIT |
