| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow apparatus capable of preventing oxidizing at a soldering part and corrosion of an electronic circuit board by a flux, at a low price and running cost, even with steam used as a thermal medium. SOLUTION: The reflow apparatus consists of a plurality of chambers 30a and 30b. It comprises a fan 62 which circulates superheated steam in the chambers 30a and 30b, a flow-in opening 70 though which the steam flows in a circulation path for the superheated steam, and a heater 64 which is arranged in the circulation path from the flow-in opening 70 to an electronic circuit board 5, in the circulation direction so that the steam in the chambers 30a and 30b is heated to be the superheated steam. COPYRIGHT: (C)2009,JPO&INPIT |
