| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape for manufacturing a semiconductor, which protects the semiconductor when manufacturing it through processes having a heating process by sticking the tape onto the semiconductor, and is easily peelable by lowering adhesive force even after the heating process. SOLUTION: The tape is used for protecting the semiconductor when manufacturing it through the processes comprising the heating process by sticking the tape onto the semiconductor, has an adhesive layer containing a photocurable adhesive and a bleeding agent having a photoreactive group which reacts with the photocurable adhesive when irradiated with light, on at least one face of a substrate, and has high adhesive force to the semiconductor at room temperature. When heated at 120°C or higher, the tape causes no advancement of adhesion due to formation of a bleed layer by bleed-out of the bleeding agent between the adhesive layer and the semiconductor, and none of the bleeding agent remains on the semiconductor when the tape is peeled off. COPYRIGHT: (C)2009,JPO&INPIT |
