| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation capability of a mounting board, while securing electric insulation, to improve the flatness and the dimensional accuracy of the surface of a mold, and further to secure sufficient strength in real use. SOLUTION: The resin molding method has an application process to apply resin to the surface of an electronic component, a degassing process to carry out degassing in vacuum atmosphere while in the application or after the application, and a molding process to mold a resin for moldings while installing in a metal mold. Moreover, the resin molding equipment includes a resin filling equipment which fills up the resin into the metal mold from a resin tub and molds it, a fixture 6 which fixes a mounting board 1, a rotation device 7 which mounts and rotates the fixture, a resin applying device which applies the resin to the surface of the electronic component of the fixed mounting board, and a vacuum tub 3 which degases the applied resin. COPYRIGHT: (C)2009,JPO&INPIT
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