| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable precise calculation of a swing angle of an electronic component held by a nozzle during a production process. <P>SOLUTION: According to a mounting method for an electronic component, an image of the electronic component held by a nozzle attached to a mounting head is imaged by an imaging means disposed opposite to the nozzle, and the position of the component is corrected based on the imaged image to mount the component on a board at a prescribed position. The mounting method includes a step of causing the imaging means to image an image of the electronic component having electrode terminals arranged at given two-dimensional positions (S1), and a step of calculating a swing angle against an imaging element surface based on the positions of the electrode terminals in the imaged image (S2 to S4). <P>COPYRIGHT: (C)2009,JPO&INPIT |
