| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a configuration in which a plurality of semiconductor chips are stacked, in which fine pitch wirings for relaying wire-bonding wires can be formed without degradation of the electric properties and physical damage of a semiconductor element formed in the semiconductor chip, and without degrading the wire-bonding strength. SOLUTION: In the semiconductor device in which semiconductor chips are stacked on a substrate 4, an interposer chip 3, having wirings 7..., is provided beneath a semiconductor chip 1. Bonding pads 15, ... on the semiconductor chip 1 are electrically connected to corresponding bonding terminals 6, ... provided on the substrate 4 via the interposer chip 3 by means of wire bonding, respectively. COPYRIGHT: (C)2009,JPO&INPIT
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