| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a long flying lead in a device hole using high tensile copper foil and a plurality of device holes. SOLUTION: In the wiring board, a plurality of device holes are formed in one carrier including an insulation film, and wiring is formed on the surface of the insulation film. The wiring is formed by the high tensile copper foil in which the tensile strength is not less than 70 kgf/mm<SP>2</SP>in a normal state, a plurality of ends in the wiring are extended to the edge of the device hole in a cantilever state to form an inner lead, and the extension length L of the inner lead extended in the device hole is not less than 40 L/W to the line width W of the inner lead. COPYRIGHT: (C)2009,JPO&INPIT
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