| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent occurrence of shorting circuit between a cathode electrode and an anode electrode of a bare chip, even if some deviation occurs at the mounting position of the bare chip when flipchip mounting. <P>SOLUTION: In a flipchip mounting method of an LED bare chip, a bump 3 is provided on an LED bare chip 1 or a circuit board 2. The LED bare chip is arranged to face the circuit board across the bump. The LED bare chip is applied with ultrasonic oscillation for thermal compression bonding, to plastically deform the bump, thereby electrically connecting the LED bare chip to the circuit board. The ultrasonic oscillation is applied in such manner as crosses diagonally a pair of facing sides of the LED bare chip. <P>COPYRIGHT: (C)2009,JPO&INPIT |
