| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board of high density wiring which is excellent in electrical connection reliability, and its manufacturing method. <P>SOLUTION: In the wiring board, an insulating layer and a wiring conductor are alternately laminated, a plurality of first wiring patterns 5A which are belt-like wiring conductors for semiconductor element connection are arranged side by side on the insulating layer 4 of the outermost layer, a plurality of connection pads 5a to each of which the electrode terminal of a semiconductor element is flip-chip connected are arranged side by side at a part of each first wiring pattern 5A, and a solder resist layer 6 with a slit-like opening 6a for exposing the upper surface of the connection pad 5a is put on the insulating layer 4 and the first wiring patterns 5A. The solder resist layer 6 is configured to fill a gap between the adjacent connection pads 5a exposed in the slit-like opening 6a. <P>COPYRIGHT: (C)2009,JPO&INPIT |
