| 摘要 |
A probe card manufacturing method is provided to reduce the whole process time without performing the formation of the photoresist layer, the etching removal process, and the conductivity metallic plating operation and polishing operation. A probe card manufacturing method comprises the following steps: the step for preparing the substrate(100) having the plurality of upper side terminals which are electrically connected to the plurality of wire portions; the step for preparing the silicon wafer sacrificial substrate and forming the plurality of penetration holes corresponding to the plurality of upper side terminals on the silicon wafer sacrificial substrate; the step for positioning the silicon wafer sacrificial substrate on the substrate corresponding to the plurality of penetration holes formed on a plurality of upper side terminal; the step for forming the plurality of base parts by introducing respective conductive metal through a plurality of penetration holes; the step for combining and fixing the plurality of probes(600) formed on a plurality of base parts.
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