发明名称 Memory devices and methods of manufacturing the same
摘要 <p>Memory devices and methods of manufacturing the same are provided. In a memory device, a memory-switch structure is formed between a first and second electrode. The memory-switch structure includes a memory resistor and a switch structure. The switch structure controls current supplied to the memory resistor. A memory region of the memory resistor and a switch region of the switch structure are different from each other.</p>
申请公布号 EP2003651(A1) 申请公布日期 2008.12.17
申请号 EP20080158140 申请日期 2008.06.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, SEUNG-EON;KIM, SUK-PIL;LEE, MYOUNG-JAE;PARK, YOUNG-SOO
分类号 G11C13/00;G11C17/14 主分类号 G11C13/00
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