发明名称 |
Sealed semiconductor device with an inorganic bonding layer and method for manufacturing the semiconductor device |
摘要 |
A disclosed semiconductor device comprises a substrate, an element on the substrate and a sealing structure for sealing the element. The sealing structure has a structure such that a partition wall made of a metallic material formed on the substrate by a plating method so as to surround the element and a cap portion disposed on the partition wall are bonded via a bonding layer made of an inorganic material. |
申请公布号 |
EP1743868(A3) |
申请公布日期 |
2008.12.17 |
申请号 |
EP20060253441 |
申请日期 |
2006.06.30 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SHIRAISHI, AKINORI |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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