CAMERA MODULE AND MANUFACTURING METHOD THEREOF

摘要

A camera module and a manufacturing method thereof are provided to prevent an adhesive from being overflowed into a side pad of a resin substrate when connecting the resin substrate with a housing by a boding method, thereby preventing an appearance defect of the camera module and improving external connectivity. A resin substrate(100) includes connection holes(110) in one side. The connection hole includes a side pad(120). A housing(200) is installed on an upper surface of a resin substrate. PSR(Photo Solder Resist) is not coated on a receiving groove unit(130) in a spot of the upper surface of the resin substrate where a lower portion of the housing is received.