发明名称 HEAT TREATMENT EQUIPMENT
摘要 A heating treatment apparatus is provided to prevent the problem that substrate is slid in a heating treatment apparatus by including a lift bar which loads and unloads substrate. A heating treatment apparatus(200) comprises a plate(210), and a lift bar(220). The substrate(230) is placed on plate. The lift bar is arranged in the plate. The lift bar is the line-shape which is comprised in order to load and unload substrate from the plate. The plate comprises a plurality of hotwires (ramp) in the plate bottom. In the lift bar, two lift bars are arranged in the edge area of the plate.
申请公布号 KR20080109560(A) 申请公布日期 2008.12.17
申请号 KR20070058032 申请日期 2007.06.13
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JEONG, KU CHEOL
分类号 H01L21/324;H01L21/477 主分类号 H01L21/324
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