| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide polishing equipment wherein an influence on a surface to be polished caused by the working precision or the like of the pressing surface of a retainer ring for pressing the vicinity of the outer peripheral edge of an abrasive cloth is reduced by using a simple structure, and the retainer ring can be released easily when pressing by the retainer ring is unnecessary. <P>SOLUTION: In the polishing equipment wherein the surface to be polished of a wafer W is pressed against the abrasive cloth 16 and mirror-finished, the retainer ring 40, a balloon type member 70 and spheres 64, 64, etc., are installed. In the retainer ring 40, a pressing plate 42 is installed which is rotatably arranged independently of a top ring 10 and presses the vicinity of the outer peripheral edge of the pressing surface of the abrasive cloth 16 in such a manner that the vicinity of the outer peripheral edge becomes the same plane as the pressing surface. The balloon type member 70 makes the pressing surface 44 of the pressing plate 42 attachable and detachable to the abrasive cloth 16 in a state that the surface to be polished of the wafer W is pressed against an abrasive surface. The spheres 64, 64, etc., are brought into contact simultaneously with the retainer ring 40 and the top ring 10 in such a manner that the retainer ring 40 and the top ring 10 rotate without being in contact with each other. <P>COPYRIGHT: (C)2004,JPO |
