| 摘要 |
A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D converter chips, and other chips in a compact package. The module permits chips that require extensive cooling to be positioned within the structure in a manner such that a large surface area of the chip is not in contact with other chips. The module also permits extensive interconnection between chips within the module.
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