| 发明名称 |
Power semiconductor package |
| 摘要 |
A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode. |
| 申请公布号 |
US7466012(B2) |
申请公布日期 |
2008.12.16 |
| 申请号 |
US20050225720 |
申请日期 |
2005.09.13 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
STANDING MARTIN;CLARKE ROBERT J |
| 分类号 |
H01L23/495;H01L23/498 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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