发明名称 Apparatus for predicting reliability in electronic device package, program for predicting reliability in electronic device package, and method for predicting reliability in electronic device package
摘要 Reliability of an electronic package is predicted based on material type, shape and dimensions of the package and conditions for assessment thereof, and a modeling unit creates a simulation model based thereon. An executing unit uses the simulation model to execute a simulation under designated conditions and results of the simulation are stored in a database. The stored simulation is assessed according to the assessment criteria and the assessment results are stored in a database. A generating unit generates, as an assessment expression, an approximate expression which infers the results of assessment from the inputted parameters, on the assumption that a predetermined amount of results of assessment is preserved. An assessment predicting unit outputs the results of an assessment of a package in which an assessment expression has already been established, by using the assessment expression.
申请公布号 US7467076(B2) 申请公布日期 2008.12.16
申请号 US20060509615 申请日期 2006.08.25
申请人 FUJITSU LIMITED 发明人 SAKAI HIDEHISA
分类号 G06F17/50;G06G7/62 主分类号 G06F17/50
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