发明名称 |
Semiconductor chips having improved electrostatic discharge protection circuit arrangement |
摘要 |
A semiconductor chip may include a plurality of pads arranged in at least a first and a second row, and a plurality of protection circuits connected to the plurality of pads. The plurality of protection circuits may include at least one diode. A first protection circuit may be connected to a first pad in the first row of pads, and a second protection circuit may be connected to a second pad in the second row of pads. The first and second protection circuits may be arranged under the first row of pads.
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申请公布号 |
US7465993(B2) |
申请公布日期 |
2008.12.16 |
申请号 |
US20070654638 |
申请日期 |
2007.01.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE KI-TAE;KIM HAN-GU;KO JAE-HYOK |
分类号 |
H01L23/62 |
主分类号 |
H01L23/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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