| 摘要 |
The dicing die bond film is provided to improve the yield by measuring the thickness without the direct impact being given to the product. The dicing die bond film(100) comprises the support base layer(130), the adhesion layer, the glue layer(120), one or more measuring units(150a, 150b, 150c, 150d). The measuring unit measures the thickness of the total layer of the dicing die bond film. The manufacturing method of the dicing die bond film comprises as follows. A step is for forming the adhesion layer on the support base the glue layer on the protective film. The first cutting stage is for removing the section except the region for adhering the wafer and thickness measurement region to the glue layer with a cutter. A step is for adhering the glue layer on the adhesion layer on the support base and protective film. The second cutting stage is for removing the section except the region for adhering the wafer and thickness measurement region to the support base and adhesion layer.
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