MANUFACTURING METHOD OF FLIP CHIP FOR ELECTRICAL FUNCTION TEST

摘要

The method of manufacturing the flip-chip is provided to lower the material cost and process cost by acting the metal seed layer as the metal pattern for the electrical connection. The method of manufacturing flip chip comprises as follows. A step is for forming the seed layer on the substrate(10). A step is for coating and patterning photoresist or the dry film. A step is for forming the gold bump(18) by performing electroplating. A step is for patterning the seed layer. A step is for forming the insulating layer(12) on the seed layer and gold bump. A step is for patterning the insulating layer.