发明名称 |
Image transfer process for thin film component definition |
摘要 |
A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of metal to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the metal layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the metal layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.
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申请公布号 |
US7465532(B2) |
申请公布日期 |
2008.12.16 |
申请号 |
US20070870364 |
申请日期 |
2007.10.10 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. |
发明人 |
CORNWELL DWIGHT;WERNER DOUGLAS JOHNSON |
分类号 |
G03F7/20;G03F7/00;G11B5/127;G11B5/31 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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