发明名称 Optical device chip, and optical module and method for manufacturing the same
摘要 An optical device chip includes: a first semiconductor layer of a first conductivity type; an optical layer that emits light or receives light formed above the first semiconductor layer; a second semiconductor layer of a second conductivity type formed above the optical layer; a first electrode electrically connected to the first semiconductor layer; a second electrode electrically connected to the second semiconductor layer; and a connecting section that short-circuits the first electrode and the second electrode.
申请公布号 US7466733(B2) 申请公布日期 2008.12.16
申请号 US20070738742 申请日期 2007.04.23
申请人 SEIKO EPSON CORPORATION 发明人 NISHIDA TETSUO
分类号 H01S3/00 主分类号 H01S3/00
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