| 摘要 |
A high-power LED package structure applied to spot lights, torch lights, structures that provide ultraviolet or infrared or white lights. The high-power LED package structure comprises at least one light emitting diode chip attached to an outer surface of a metallic heat sink of high heat conductivity. The structure further comprises a heat-conducting base on which the metallic heat sink is embedded. There is an insulating layer between the metallic heat sink and the heat-conducting base. The tri-structure significantly increases the mechanical toughness and the heat-conducting area of the present invention, whereby the heat produced in the metallic heat sink will be diffused quickly to the heat-conducting base and then dissipated away. Therefore, the effect of heat dissipation will be enhanced.
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