GALVANISCHER PROZESS ZUR FÜLLUNG VON DURCHGANGSLÖCHERN MIT METALLEN, INSBESONDERE VON LEITERPLATTEN MIT KUPFER

摘要

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.