SEMICONDUCTOR APPARATUS OF FURNACE TYPE

摘要

The furnace type equipment for semiconductor fabrication is provided to omit the additional flange member since the process tube includes the exhaust port and nozzle port. The furnace equipment for semiconductor fabrication comprises the process tube(100), the wafer boat(200), the heater(300), the nozzle member(400). The process tube is made of the cylinder tube of dome-shape. The wafer boat is located within the process tube. The nozzle member sprays the process gas to wafers loaded in the wafer boat. The nozzle member comprises the showerhead(410) as the coil shape along the inner side of the process tube.