| 摘要 |
A film position adjusting method is provided to easily correct a discrepancy of a film depositing position in a substrate processing system. The substrate processing system is comprised of a process chamber (12), and an orienter (16) for centering of a wafer (W) to be carried in the process chamber (12). The orienter (16) is provided with an orienter sensor (42) for measuring a discrepancy at the central position of the wafer (W), and an image sensor (41) for measuring a width of a non-film depositing portion at circumferential portions of the wafer (W). Subjected to film deposition processing in the process chamber (12), the wafer (W) is carried to the orienter (16) where a discrepancy from the central position of the wafer (W) is measured, the wafer (W) is then subjected to centering, and the width of the non-film depositing portion of the wafer (W) is measured, and a film position discrepancy is calculated in accordance with the width of the non-film depositing portion. To correct the calculated film position discrepancy, a wafer carrying target position on a receiving plate (13) in the process chamber (12) is adjusted. ® KIPO & WIPO 2009
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