POWER SEMICONDUCTOR MODULE ASSEMBLY HAVING HEAT SINK

摘要

A power semiconductor module assembly including the heat sink is provided to reduce the area of the electrical semiconductor module by inserting the protrusion of the plastic case of the electrical semiconductor module into the depression of the heat sink. The power semiconductor module assembly comprises the electrical semiconductor module(200), and the heat sink(300). The inside of the electrical semiconductor module is shut tightly by the case(210) in which the protrusion(240) is formed at both sides of the lower main plane. The heat sink is combined with the lower main plane of the electrical semiconductor module. The depression(310) into which the protrusion is inserted and combined is formed along the bi-edge of the upper main face of the heat sink. One end of both end part of bi-edge is open to insert the protrusion into the depression.