发明名称 METHOD FOR MANUFACTURING HEAT RADIATING MEMBER AND SEMICONDUCTOR DEVICE USING HEAT RADIATING MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a method for processing an insulating sheet to fit it to the surface shape of a heat sink without generating notches and scraps of the insulating sheet. SOLUTION: The method for manufacturing a heat radiating member obtained by sticking an insulating sheet 20 to a heat sink 10 comprises a process for preparing an upper press board 240 and a lower press board 230 which are arranged in parallel, a process for arranging the heat sink 10, the insulating sheet 20 and a deformable member 210 on the lower press board 230 in the order, and a process for pressing the deformable member 210 to the direction of the heat sink 10 between the upper press board 240 and the lower press board 230, deforming and extruding the deformable member 210 from the space between the heat sink 10 and the upper press board 240 to the side-face side of the heat sink 10 and cutting the insulating sheet 20 along the side face of the heat sink 10 by the extruded deformable member. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300713(A) 申请公布日期 2008.12.11
申请号 JP20070146565 申请日期 2007.06.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 SANO KO;KOMORI HIDEKI;HAYASHI KENICHI
分类号 H01L23/36 主分类号 H01L23/36
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