| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To contrive an improvement of bondability between an Au pad and an Au wire that are formed in a circuit board. <P>SOLUTION: A semiconductor package 1 is provided with: a circuit board 3 with a wiring pattern 8 formed; a solder resist 4 formed on the upper layer of the wiring pattern; a semiconductor chip 2 mounted in the die bond region of the solder resist; an Au pad 7 formed by depositing a plating layer in the bonding region of the wiring pattern; an Au wire 6 for electrically connecting the semiconductor chip with the Au pad; and a mold resin 9 for sealing the semiconductor chip. In the semiconductor package 1, the surface roughness of the region coated with the solder resist of the wiring pattern is made larger than the surface roughness of the Au pad formation region of the wiring pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
