| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin which has high heat-resistance and high transparency, is soluble in a solvent, is excellent in molding processability and is excellent in toughness, a polyimide film obtained by forming the polyimide resin, and electric and electronic parts comprising the polyimide film. SOLUTION: The solvent-soluble polyimide resin is obtained from a cyclohexanetetracarboxylic acid dianhydride of a cis-structure and bis(aminophenoxyphenyl)sulfone. COPYRIGHT: (C)2009,JPO&INPIT
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