发明名称 |
THREE-DIMENSIONAL PACKAGE STRUCTURE |
摘要 |
A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.
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申请公布号 |
US2008303125(A1) |
申请公布日期 |
2008.12.11 |
申请号 |
US20070847351 |
申请日期 |
2007.08.30 |
申请人 |
CHEN DA-JUNG;LIU CHUN-TIAO;WEN CHAU-CHUN |
发明人 |
CHEN DA-JUNG;LIU CHUN-TIAO;WEN CHAU-CHUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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