| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device in which even when a semiconductor light emitting element and a substrate etc., are joined together through a collet with an ultrasonic wave, distal ends of a rugged shape of a light projection surface are not crushed. <P>SOLUTION: A portion having a fine rugged area and a flat area are formed on the light projection surface, and the collet is brought into contact in the flat area, so that the rugged part is not crushed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
