| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method in which the cleaning of a forming mold capable of removing efficiently dirty inside of the forming mold can be carried out. SOLUTION: A forming mold cleaning sheet 8, where a plurality of fine holes through which particles of cleaning resin 9 can pass are formed on the whole surface, is prepared, the forming mold cleaning sheet 8 is clamped so as to come into contact with the whole area of parting surface of the forming mold 1 composed of an upper mold 1a and a lower mold 1b, the cleaning resin 9 is pressed to be filled into the inside of the forming mold 1 penetrating it into the forming mold cleaning sheet 8, the upper mold 1a and 1b are released after a fixed time passes, then, the forming mold cleaning sheet 8 on which the cleaning resin 9 is deposited is taken out. COPYRIGHT: (C)2009,JPO&INPIT |
