RESIN-ENCAPSULATED LIGHT EMITTING DIODE AND METHOD FOR ENCAPSULATING LIGHT EMITTING DIODE

摘要

A LED device is provided, in which a LED element is encapsulated in a material less susceptible to damages caused by rapid temperature changes. The LED element is coated with an addition-curable soft silicone and is further encapsulated in a resin-like, addition-curable silicone. The soft silicone is characterized in having a cured hardness of 5 to 75 by a Type E Durometer and being a cured product of a composition comprising of (A) an organopolysiloxane that has an average of at least 1.8 alkenyl groups per molecule bonded to a silicon atom, (B) an organohydrogenpolysiloxane that has an average of at least 4 hydrogen atoms per molecule bonded to a silicon atom, and (C) a hydrosilylation catalyst.