| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing apparatus for a wafer which can prevent a probe from running out of a testing pad when an electric test accompanying heating a substrate is carried out, and a testing method. SOLUTION: The testing apparatus for the wafer has a probe card 3 provided with a plurality of probes 8, a wafer stage 12 which heats a semiconductor wafer W, and can move to a position opposite to the probe card 3, a hot plate 22, and a camera 20 observing the probe 8. The position information of the probe 8 is acquired by observing the probe 8 with the camera 20, while heating the probe 8 by the hot plate 22. The wafer stage 12 is moved to a position at which a testing pad P of the semiconductor wafer W touches the probe 8 based on the position information. COPYRIGHT: (C)2009,JPO&INPIT
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