| 摘要 |
PROBLEM TO BE SOLVED: To provide a paste composed of a modified polyimide-based resin composition excellent in (1) solubility in a non-nitrogen solvent, (2) dryability/curability at a low temperature, (3) low warping tendency, (4) flexibility and (5) printability, and having excellent heat-resistance, chemical resistance, electric properties, workability and economy and to provide an electronic part having a solder resist layer, a surface protection layer, an interlayer insulation layer or an adhesive layer obtained by using the paste. SOLUTION: The modified polyimide resin composition contains (A) a modified polyimide resin containing (a) a trivalent and/or tetravalent polycarboxylic acid derivative having an acid anhydride group, (b) a polyol expressed by general formula (1) and (c) an aromatic polyamine residue derivative as essential components, (B) an epoxy resin having two or more epoxy groups in one molecule, (C) an inorganic or organic filler and (D) a non-halogenic flame-retardant soluble in the modified polyimide resin. COPYRIGHT: (C)2009,JPO&INPIT
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