| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device capable of performing soldering of high quality. SOLUTION: The soldering device 1 includes: a heating/melting part 5 melting solder; and a tip member 8 applying vibration to the solder in a melted state fed from the heating/melting part 5. The heating/melting part 5 and the tip member 8 are closely arranged without being contacted with each other. COPYRIGHT: (C)2009,JPO&INPIT
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