| 摘要 |
A positive photosensitive resin composition characterized by comprising: a resin which comprises a specific acrylic structural unit having an acid-dissociable group and yielding a carboxy group upon dissociation of the acid-dissociable group and a structural unit having a functional group capable of reacting with a carboxy group to form a covalent bond, and which is insoluble or sparingly soluble in alkalis and becomes alkali-soluble upon dissociation of the acid-dissociable group; and a compound which generates an acid upon irradiation with actinic rays or a radiation. Also provided is a method of forming a cured film from the composition. The positive photosensitive resin composition is excellent in sensitivity, film thickness retention, and storage stability. The method, which is for forming a cured film from the positive photosensitive resin composition, can give a cured film excellent in heat resistance, adhesion, transmittance, etc. |
